Temperature dependence of thermal resistance of a bare joint

4Citations
Citations of this article
7Readers
Mendeley users who have this article in their library.
Get full text

Abstract

Temperature dependence of thermal resistance of a bare joint between two crossed platinum wires was measured using a quasi steady-state T-type probe in the temperature range of 100-300 K. The thermal resistance was found to decrease rapidly as the temperature increased from 100 to 200 K, then the trend slowed down, which could be explained by the temperature behaviors of the hardness and elastic modulus of platinum. Considering both the microscopic and macroscopic thermal resistances, the calculated results fitted well with the experimental data, and the obtained conductance-load exponent was also within the reasonable range. © 2010 Elsevier Ltd. All rights reserved.

Cite

CITATION STYLE

APA

Wang, J., Song, B., Gu, M., & Zhang, X. (2010). Temperature dependence of thermal resistance of a bare joint. International Journal of Heat and Mass Transfer, 53(23–24), 5350–5354. https://doi.org/10.1016/j.ijheatmasstransfer.2010.07.021

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free