Thermal modelling of semiconductor packages

  • Franke T
  • Froehler U
  • 2

    Readers

    Mendeley users who have this article in their library.
  • 1

    Citations

    Citations of this article.

Abstract

This paper presents an improved approach for thermal characterization and simulation of semiconductor packages. The model can significantly reduce the simulation efforts for the design of complex technical thermal systems. It will be shown that the principle of superposition can be used to overcome the problems of thermal resistance narrowings. As the model structure implements a biunique mapping between a special set of border conditions and its parameters, a simple characterization procedure can be applied and the accuracy of the model is found to be independent of the boundary conditions. © 2001 Elsevier Science Ltd. All rights reserved.

Author-supplied keywords

  • Compact modelling
  • Semiconductor packages
  • Thermal simulation

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document

Authors

  • T. Franke

  • U. Froehler

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free