Thermal modelling of semiconductor packages

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Abstract

This paper presents an improved approach for thermal characterization and simulation of semiconductor packages. The model can significantly reduce the simulation efforts for the design of complex technical thermal systems. It will be shown that the principle of superposition can be used to overcome the problems of thermal resistance narrowings. As the model structure implements a biunique mapping between a special set of border conditions and its parameters, a simple characterization procedure can be applied and the accuracy of the model is found to be independent of the boundary conditions. © 2001 Elsevier Science Ltd. All rights reserved.

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APA

Franke, T., & Froehler, U. (2001). Thermal modelling of semiconductor packages. Microelectronics Journal, 32(10–11), 809–816. https://doi.org/10.1016/S0026-2692(01)00067-2

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