Uncovering the driving force for massive spalling in the Sn-Cu/Ni system

  • Chen W
  • Yang S
  • Tsai M
 et al. 
  • 2


    Mendeley users who have this article in their library.
  • 16


    Citations of this article.


To identify the driving force for the massive spalling phenomenon, carefully designed experiments were carried out. Cu-doped Sn-rich solder was reacted with Ni to form first the Sn-0.6Cu/(Cu,Ni)6Sn5/Ni structure. The original Sn-0.6Cu solder was then removed and replaced with Sn-0.3Cu or with fresh Sn-0.6Cu. Swapping the solder to Sn-0.3Cu caused massive spalling of (Cu,Ni)6Sn5. The results of this study unequivocally prove that the massive spalling reported in the literature is caused by a driving force that is purely thermodynamic in nature. © 2010 Acta Materialia Inc.

Author-supplied keywords

  • Intermetallic compounds
  • Soldering

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document


Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free