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Adarsh Basavalingappa

  • Process Engineer Intern
  • LAM Research Corp
  • 2h-indexImpact measure calculated using publication and citation counts. Updated daily.
  • 10CitationsNumber of citations received by Adarsh's publications. Updated daily.

Other IDs

Research interests

Intellectual PropertyReliabilityElectromigrationStress VoidingPlasma EtchTCAD

Co-authors (24)

Publications (5)

  • Electromigration: Lognormal versus Weibull distribution

    • Basavalingappa A
    • Passage J
    • Shen M
    • et al.
    N/AReaders
    0Citations
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  • Effect of Ion Flux in Source-Drain Extension Ion Implantation for 10-nm Node FinFet and beyond on 300/450mm Platforms

    • Shen M
    • Basavalingappa A
    • Borst C
    • et al.
    N/AReaders
    1Citations
    Get full text
  • Effect of texture and elastic anisotropy of copper microstructure on reliability

    • Basavalingappa A
    • Shen M
    • Lloyd J
    N/AReaders
    1Citations
    Get full text
  • Level-set multilayer growth model for predicting printability of buried native extreme ultraviolet mask defects

    • Upadhyaya M
    • Basavalingappa A
    • Herbol H
    • et al.
    N/AReaders
    2Citations
    Get full text
  • Effect of via arrangement on electromigration performance

    • Zhang Z
    • Basavalingappa A
    • Lloyd J
    • et al.
    N/AReaders
    0Citations
    Get full text

Professional experience

Process Engineer Intern

LAM Research Corp

August 2014 - Present

Education

PhD

State University of New York - University at Albany

August 2013 - Present