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shang shengyan

    • 9PublicationsNumber of items in shang's My Publications folder on Mendeley.
    • 3Followers

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    Publications (5)

    • All-round suppression of Cu 6 Sn 5 growth in Sn/Cu joints by utilizing TiO 2 nanoparticles

      • Shang S
      • Kunwar A
      • Yao ·
      • et al.
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    • Evolution behavior and growth kinetics of intermetallic compounds at Sn/ Cu interface during multiple reflows

      • Ma H
      • Kunwar A
      • Shang S
      • et al.
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    • Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

      • Kunwar A
      • Shang S
      • Råback P
      • et al.
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    • Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

      • Kunwar A
      • Guo B
      • Shang S
      • et al.
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    • Synthesis of Cu@Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity

      • Shang S
      • Kunwar A
      • Wang Y
      • et al.
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