Comparison Investigation of Thermal Fatigue and Mechanical Fatigue Behavior of Board Level Solder Joint

  • Lin J
  • Lei Y
  • Wu Z
 et al. 
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Author-supplied keywords

  • fem
  • joint
  • mechanical fatigue
  • solder
  • surface mounted technology
  • thermal fatigue

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Authors

  • Jian Lin

  • Yongping Lei

  • Zhongwei Wu

  • Lanli Yin

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