Integration of materials with a high dielectric constant into storage or gate capacitor applications requires a detailed understanding of the crystallization behavior. The dependence of crystallinity on annealing temperature and time was studied for thin atomic-layer-deposited (ALD) Al2O3 films of varying thickness, using grazing-incidence X-ray diffraction. The correlation between dielectric constant and annealing condition was investigated and an increase in dielectric constant due to annealing was observed. © 2002 Elsevier Science B.V. All rights reserved.
CITATION STYLE
Jakschik, S., Schroeder, U., Hecht, T., Gutsche, M., Seidl, H., & Bartha, J. W. (2003). Crystallization behavior of thin ALD-Al2O3 films. Thin Solid Films, 425(1–2), 216–220. https://doi.org/10.1016/S0040-6090(02)01262-2
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