Electrochemistry nanometric patterning of MOF particles: Anisotropic metal electrodeposition in Cu/MOF

  • Doménech A
  • García H
  • Doménech-Carbó M
 et al. 
  • 39

    Readers

    Mendeley users who have this article in their library.
  • 27

    Citations

    Citations of this article.

Abstract

Electrodeposition of copper from Cu/MOF immersed into acetate buffer produces a quasi-periodic series of 10-20 nm sized laminae sandwiched within the pristine MOF lattice as monitored by voltammetry of microparticles/atomic force microscopy. This anisotropic patterning can be qualitatively described in terms of a highly orientation-dependent diffusion of electrons and charge-balancing electrolyte counterions in the MOF network. © 2006 Elsevier B.V. All rights reserved.

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document

Authors

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free