Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling

  • Sakanova A
  • Yin S
  • Zhao J
 et al. 
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Abstract

The tendency of increasing power rating and shrinking size of power electronics systems requires advanced thermal management technology. Introduction of micro-channel heat sink into power electronics cooling has significantly improved the cooling performance. In present work, two advanced micro-channel structures, i.e. double-layer (DL) and double-side (sandwich) with water as coolant, are optimized and compared by computational fluid dynamics (CFD) study. The micro-channels are integrated inside the Cu-layer of direct bond copper (DBC). The effects of inlet velocity, inlet temperature, heat flux are investigated during geometry optimization. The major scaling effects including temperature-dependent fluid properties and entrance effect are considered. Based on the optimal geometry, the sandwich structure with counter flow shows a reduction in thermal resistance by 59%, 52% and 53% compared with single-layer (SL), DL with unidirectional flow and DL with counter flow respectively. Water based Al2O3(with concentration of 1% and 5%) nanofluid is further applied which shows remarkable improvement for wide channels. © 2014 Elsevier B.V. All rights reserved.

Author-supplied keywords

  • CFD
  • Direct bond copper
  • Micro-channel heat sink
  • Nanofluid
  • Power electronic cooling

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