Adhesive bonding is a viable technique for joining a wide range of
materials. However, increasing the lifetime, reducing the costs,
and improving the safety of structures are highly demanded nowadays.
Hence, the development of new technologies and processes for easy
recycle, heal, or self-heal of bonded structures are becoming of
great interest for the industry. This paper provides an overview
of the current developments in the use of �smart� adhesive technology
and introduces the reader to early findings on the use of self-healing
materials, thermally expandable particles, and nanoparticles, among
others, in adhesives and their potential to increase the reliability
of adhesive joints.
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