During the development of SoC (System on Chip) Systems, the thermal design aspects have proved crucial to its reliable operation. Reducing thermally induced stress and preventing local overheating remain major concerns when optimizing the capabilities of the LAIC (Large Area Integrated Circuits) based technology. Thermal monitoring is essential in integrated circuit (IC) and VLSI chip which are a multilayer structure and a stack of different materials. Thermal phenomena research activities on micro-scale level are essential for SoC and MEMS-based applications. However, various measurement techniques are needed to understand the thermal behavior of VLSI chip. In particular, measurement techniques for surface temperature distributions of large VLSI systems are a highly challenging research topic. This paper presents an approach and the experimental result of silicon-die thermal monitoring using embedded sensor cells unit. Sensor implementation results and analysis are also presented.
Mendeley saves you time finding and organizing research
There are no full text links
Choose a citation style from the tabs below