This paper presents a solder joint engineering reliability model - Solder Reliability Solutions1 (SRS) - and its application to surface mount area-array and chip-scale assemblies. The model is validated by failure data from thirty three accelerated thermal cycling tests, and test vehicles covering several generations of component, assembly and circuit board technologies and a variety of test conditions. The SRS model has been implemented as a PC-based design-for-reliability tool that enables rapid assessment of assembly reliability in the early stages of product development.
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