Solder Reliability Solutions: A PC-based Design-for-reliability Tool*

  • Clech J
  • 14


    Mendeley users who have this article in their library.
  • 8


    Citations of this article.


This paper presents a solder joint engineering reliability model - Solder Reliability Solutions1 (SRS) - and its application to surface mount area-array and chip-scale assemblies. The model is validated by failure data from thirty three accelerated thermal cycling tests, and test vehicles covering several generations of component, assembly and circuit board technologies and a variety of test conditions. The SRS model has been implemented as a PC-based design-for-reliability tool that enables rapid assessment of assembly reliability in the early stages of product development.

Author-supplied keywords

  • Solder joint fatigue
  • area-array / chip-scale assemblies
  • design-for-reliability
  • predictive modeling

Get free article suggestions today

Mendeley saves you time finding and organizing research

Sign up here
Already have an account ?Sign in

Find this document


  • JP Clech

Cite this document

Choose a citation style from the tabs below

Save time finding and organizing research with Mendeley

Sign up for free