Solder Reliability Solutions: A PC-based Design-for-reliability Tool*

  • Clech J
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Abstract

This paper presents a solder joint engineering reliability model - Solder Reliability Solutions1 (SRS) - and its application to surface mount area-array and chip-scale assemblies. The model is validated by failure data from thirty three accelerated thermal cycling tests, and test vehicles covering several generations of component, assembly and circuit board technologies and a variety of test conditions. The SRS model has been implemented as a PC-based design-for-reliability tool that enables rapid assessment of assembly reliability in the early stages of product development.

Author-supplied keywords

  • Solder joint fatigue
  • area-array / chip-scale assemblies
  • design-for-reliability
  • predictive modeling

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Authors

  • JP Clech

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