Soldering technology for optoelectronic packaging

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Abstract

Integration of high-speed Internet access, telephone, and cable is a major driving force for fiber-optical networking and related technologies. Cost reduction is critical to accelerating the market growth of optoelectronic modules and systems, and it is estimated that packaging contributes 60 to 90% of the overall cost of an optoelectronic module (Iezekie et al., 1997), and alignment can contribute up to 90% of the packaging cost. As a result, it is necessary to connect and maintain hundreds of optical precision alignments through a batch assembly process that is compatible with the existing manufacturing infrastructure. Soldering is the technology of choice for such a cost-effective assembly process. In addition to providing electrical connections, solder is useful in the formation of passive, precision alignments for optoelectronic packaging. It can be used to couple optical fibers or waveguides to devices such as lasers, light-emitting diodes, or photodetectors. The alignments can vary from submicrometer to micrometer levels for single- or multimode fiber applications. Different designs have demonstrated precision alignments, and the aligned structures are becoming more and more complex (Lee and Basavanhally, 1994).

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Tan, Q., Lee, Y. C., & Itoh, M. (2005). Soldering technology for optoelectronic packaging. In Passive Micro-Optical Alignment Methods (pp. 149–186). CRC Press. https://doi.org/10.1201/9781420027723.ch5

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