We have successfully sculptured a variety of copper films with open interconnected macroporous walls and nanoparticles using hydrogen bubbles as the dynamic template. In this process, the hydrogen bubbles arising from the electrochemical reduction of H+ in the deposition process functioned as the dynamic template for metal electrodeposition. Cu was electrodeposited and grew within the interstitial spaces between the hydrogen bubbles to form a macroporous film of Cu nanoparticles on the substrate, showing a typical integration of micro−nanostructure. The pore diameters and wall thickness of the porous copper films were successfully tailored by adjusting the concentration of the electrodeposition electrolyte, the applied current density, and the concentration of the surfactant (cetyltrimethylammonium bromide, CTAB). Water contact angle measurements showed that the hydrophobicity of the prepared porous structures could be tuned by changing the pore size and wall thickness.
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