We have demonstrated fluidic chip self-assembly on Si wafers for fabricating three-dimensional integrated circuits. In this self-assembly technique, small droplets of hydrofluoric acid were employed to simultaneously align many millimeter-scale chips and directly bond them to the hydrophilic bonding areas formed on the host wafers by oxide-oxide bonding. The liquid surface tension enables many Si chips to be self-assembled with the highest alignment accuracy of 50 nm. In addition, many chips were tightly bonded to the hydrophilic bonding areas without applying a mechanical force after the liquid was evaporated at room temperature. © 2010 American Institute of Physics.
CITATION STYLE
Fukushima, T., Iwata, E., Konno, T., Bea, J. C., Lee, K. W., Tanaka, T., & Koyanagi, M. (2010). Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits. Applied Physics Letters, 96(15). https://doi.org/10.1063/1.3328098
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