Packaging of a 128 by 128 Liquid-Crystal-On-Silicon Spatial Light Modulator Using Self-Pulling Soldering

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Abstract

A self-pulling soldering technology has been demonstrated for assembling liquid crystal on silicon (LCOS) spatial light modulators (SLM‘s). Solder joints with different profiles and sizes are designed to provide vertical surface tension forces to control the gap accommodating the ferroelectric liquid crystal (FLC) layer in the range of a micron with sun-micron uniformity. This technology provides an automatic, batch assembly process for a LCOS SLM through one reflow process. The component designs and process optimization are described, and the first operational results are presented. © 1995 IEEE. All rights reserved.

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Ju, T. H., Lin, W., Lee, Y. C., McKnight, D. J., & Johnson, K. M. (1995). Packaging of a 128 by 128 Liquid-Crystal-On-Silicon Spatial Light Modulator Using Self-Pulling Soldering. IEEE Photonics Technology Letters, 7(9), 1010–1012. https://doi.org/10.1109/68.414685

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