A simple low cost method of nanoimprinting has been developed. The technique uses a flexible disposable master and lends itself to roll-to-roll processing. Residual layer thicknesses of 5-10 nm are routinely achieved. This enables the critical step of pattern transfer into hard substrates by reactive ion etching, an essential step in the fabrication of sub-wavelength photonic device elements on a wafer-scale. © 2008 Elsevier B.V. All rights reserved.
CITATION STYLE
Hubbard, G., Abbott, S. J., Chen, Q., Allsopp, D. W. E., Wang, W. N., Bowen, C. R., … Kováč, J. (2009). Wafer-scale transfer of nanoimprinted patterns into silicon substrates. Physica E: Low-Dimensional Systems and Nanostructures, 41(6), 1118–1121. https://doi.org/10.1016/j.physe.2008.08.014
Mendeley helps you to discover research relevant for your work.