Pseudomonas aeruginosa is one of the opportunistic nurses, which possesses many virulence factors which makes it a high ability to resist antibiotics multidrug-resistant (MDR).leading to make Antimicrobial resistance is one of the main threats to human health because it leads to increased infection rates and mortality. The present study aimed to evaluate the mechanism of inhibitory effect of the free CuO nanocomposite and its synergistic effect with the anti-bacterial erythromycin ER after it was loaded on the CuO / ER nanoparticle on Pseudomonas aeruginosa isolated from Al-Hindiya General Hospital. The CuO nanoparticles were manufactured by using precipitation method. Diagnosis free CUO and nanoparticles after they were loaded onto nanocomposites by using the AFM atomic force microscope. the inhibition zone diameter measured by Disc Diffusion method the results was indicated the highly synergistic effect on bacteria, while the free nanoparticles are less effective, whereas the antibiotic alone gave the lowest inhibition diameter (21.25 ±0.854, 11.75 ±0.750, 8.50 ±1.040) respectively, moreover this study investigated that The release of the antibiotic ER from the CuO / ER that the second pseudo order model is more applicable to the interpretation of the behavior of ER release from CuO / ER (K = 2.60min-1, r2 = 0.997) which indicates that the forces controlling the release of ER are flexible without dissociation and being affected by the metabolism, and the percentage of ER release was significant due to the intensity of the surface ion exchange between CuO / ER and the anion (CO3)- 2 coming from CaCO, which makes the ER release rate to reach more than 98% in the medium of sodium carbonate at a concentration of 0.05 M within 250 minutes of the start time of the reaction.
CITATION STYLE
Hussein, K. A. M., & Khalaf, A. A. (2020). Preparation, diagnosis and study of the inhibitory effect of copper nanoparticles before and after Erythromycin loading on Pseudomonas aeruginosa. In IOP Conference Series: Materials Science and Engineering (Vol. 928). IOP Publishing Ltd. https://doi.org/10.1088/1757-899X/928/6/062003
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