Silicon optical interposers for high-density optical interconnects

Abstract

One of the most serious challenges in the information industry is bandwidth bottlenecks in inter-chip interconnects. We proposed a photonics–electronics convergence system in response to this issue, demonstrated silicon optical interposers integrated with all optical components on a silicon substrate, and achieved a high bandwidth density of 30 Tbps/cm2, which is sufficient for the needs of the late 2010s.