Nanopackaging Requests for Atomic Scale Circuits and Molecule-Machines

Abstract

Starting from the requirement of fabricating a large atomic flat surface for supporting a functioning electronic atomic scale circuit, the different possible architectures of an atomic scale Boolean logic circuit are discussed in the prospect to be supported by such a surface and encapsulated at the end of the fabrication process. This leads to look after the best possible interconnection strategy to beneficiate from the possibly large calculating power of a large atomic scale circuit. This has many consequences on the final packaging of such a circuit while preserving the atomic scale precision of its construction and while offering a large number of interconnects from the atomic scale to the external world.