This paper proposes a two-stage joint optimization problem of green manufacturing and maintenance for semiconductor wafer (TSGMM-SW) considering manufacturing stage, inspection, and repair stage simultaneously, which is a typical NP-hard problem with practical research significance and value. Aiming at this problem, a green scheduling model with the objective of minimizing makespan, total carbon emissions, and total preventive maintenance (PM) costs is constructed, and an improved hybrid multiobjective multiverse optimization (IHMMVO) algorithm is proposed in this paper. The joint optimization of green manufacturing and maintenance is realized by designing synchronous scheduling and maintenance strategy for wafer manufacturing and equipment PM. The diversity of the population is expanded and the optimization performance of IHMMVO is improved by designing the initial population fusion strategy and subpopulation evolution strategy. In the experimental phase, we perform the simulation experiments of 900 test cases randomly generated from 90 parameter combinations. The IHMMVO algorithm is compared with other existing algorithms to verify the effectiveness and feasibility for TSGMM-SW.
CITATION STYLE
Dong, J., & Ye, C. (2020). Research on Two-Stage Joint Optimization Problem of Green Manufacturing and Maintenance for Semiconductor Wafer. Mathematical Problems in Engineering, 2020. https://doi.org/10.1155/2020/3974024
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