Consumer electronic applications are the primary target of the Pb-free initiative and package assembly and performance is affected by the move from eutectic Sn-Pb to Pb-free solder alloys. This paper outlines the key issues and mitigation possibilities for package assembly using Pb-free solders: High temperature reflow, Interfacial reactions, and Reliability. At the high temperatures required to reflow Pb-free alloys, moisture absorbed into the package can result in delamination and failure. The reaction of the Pb-free solder with Ni and Cu metallizations results in interfacial intermetallics that are not significantly thicker than with Sn-Pb but provide a path for fracture under mechanical loading due to the increased strength of the Pb-free alloys. The reliability issues discussed include thermomechanical fatigue, mechanical shock, electromigration and whiskering. The Pb-free alloys tend to improve thermomechanical fatigue and electromigration performance but are detrimental to mechanical shock and whiskering. Design trade-offs must be made to successfully implement Pb-free alloys into consumer applications. © 2007 Springer Science+Business Media, LLC.
CITATION STYLE
Frear, D. R. (2007). Issues related to the implementation of Pb-free electronic solders in consumer electronics. In Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics (pp. 319–330). Springer US. https://doi.org/10.1007/978-0-387-48433-4_21
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