Dielectric Properties of Acacia Wood Bio-composites

Abstract

In this chapter, pure PLA, PHA, PLA/PHA (1:1 ratio of PLA/PHA), and NCHB-PLA/PHA (1 wt% of NCHB; 1:1 ratio of PLA/PHA) with addition of different fiber loadings (i.e. 5 wt%, 10 wt%, 15 wt% and 20 wt%) are fabricated. It is found that the addition of Acacia wood (AW), caused an inrease in the dielectric constant, dissipation factor and loss factor. The highest optimum value was obtained at 20 wt% fiber loadings. Addition of AW fiber caused an increase in the dielectric constant, dissipation factor and loss factor. Chemical modification on the AW fiber were also done and resulted, which resulted in the increase of hydrophobicity of the modified AW fiber. Polymer blend created better interlocking, reduce the formation of bubble/void, which create low dielectrical properties than PLA and PHA itself. Addition of NCHB stabilizes the dielectric constant, dissipation factor and loss factor, which led to a smoother data, when compared to other results.