Abstract
Ultra water-repellent films for which contact angles of water drops exceed 150° were prepared by microwave plasma-enhanced CVD using two kinds of organosilicon compound and fluoro-alkyl silane (FAS) at low substrate temperature. Hexamethyldisilane (HMDS) and hexamethyldisiloxane (HMDSO) were used as starting materials. Molecular orbital (MO) calculation suggested that HMDS was more easily decomposable than HMDSO. The films prepared with HMDS and FAS had ultra water repellency. On the other hand, water repellency of the films prepared with HMDSO and FAS was similar to that of polytetrafluoroethylene.
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Tarai, O., Hozumi, A., Inoue, Y., & Komori, T. (1997). Application of MO calculation to plasma-enhanced CVD using organosilicon compounds. Bulletin of Materials Science, 20(6), 817–822. https://doi.org/10.1007/bf02747421
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