Resistance drift in Ge2Sb2Te5phase change memory line cells at low temperatures and its response to photoexcitation

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Abstract

Resistance drift in amorphous Ge2Sb2Te5 is experimentally characterized in melt-quenched line cells in the range of 300 K to 125 K and is observed to follow the previously reported power-law behavior with drift coefficients in the range of 0.07 to 0.11 in the dark, linearly decreasing with 1/kT. While these drift coefficients measured in the dark are similar to commonly observed drift coefficients (∼0.1) at and above room temperature, measurements under light show a significantly lower drift coefficient (0.05 under illumination vs 0.09 in the dark at 150 K). Periodic on/off switching of light shows a sudden decrease/increase in resistance, attributed to photo-excited carriers, followed by a very slow response (∼30 min at 150 K) attributed to contribution of electron traps and slow trap-to-trap charge exchanges. A device-level electronic model is used to relate these experimental findings to gradual charging of electron traps in amorphous Ge2Sb2Te5, which gives rise to growth of a potential barrier for holes in time and, hence, resistance drift.

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Khan, R. S., Dirisaglik, F., Gokirmak, A., & Silva, H. (2020). Resistance drift in Ge2Sb2Te5phase change memory line cells at low temperatures and its response to photoexcitation. Applied Physics Letters, 116(25). https://doi.org/10.1063/1.5144606

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