Development of plasma CVM (Chemical Vaporization Machining)

1Citations
Citations of this article
19Readers
Mendeley users who have this article in their library.

Abstract

Conventional machining processes, such as turning, grinding, or lapping are still applied for many materials including functional ones. But those processes are accompanied with deformed layer, so that machined surfaces cannot perform original functions. In order to avoid such points, Plasma CVM (Chemical Vaporization Machining) has been developed. Plasma CVM is a chemical machining method using neutral radicals, which are generated by the atmospheric pressure plasma. By using the high-speed rotary electrode for generating the plasma, the machining efficiency which was equal to the mechanical machining method was achieved. Furthermore, generated plasma is localized around the electrode with effect of high-pressure atmosphere, so good spatial resolution of machining is also achieved. The defect density of machined surface is very low, and it is equivalent to the chemical etching.

Cite

CITATION STYLE

APA

Mori, Y., Yamauchi, K., Yamamura, K., & Sano, Y. (2000). Development of plasma CVM (Chemical Vaporization Machining). Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 66(8), 1280–1285. https://doi.org/10.2493/jjspe.66.1280

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free