Hybrid Laser Processing of Transparent Materials

Abstract

The following chapter is an overview of processing fused silica and other transparent materials by pulsed-laser irradiation: (1) Direct excitation of materials with multi-wavelength excitation processes, and (2) Media-assisted process with a conventional pulsed laser. A method to etch transparent materials by using laserinduced plasma-assisted ablation (LIPAA), or laser-induced backside wet etching (LIBWE), has been described in detail.