Based on the daily work summary and the induction of actual case processing methods, a systematic and hierarchical process verification scheme of BGA solder joints is proposed in the paper. Then the verification scheme is introduced through an actual case. Based on the application examples, the scheme is confirmed to ensure the adequacy of the experimental dates, and the rigorous and accuracy of the conclusion.
CITATION STYLE
Lu, W., Jin, D., & Wan, Y. (2020). Systematic verification of bga solder joint reliability in multiple ways. In Lecture Notes in Electrical Engineering (Vol. 589, pp. 947–959). Springer Verlag. https://doi.org/10.1007/978-981-32-9441-7_97
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