Effect of Sintering Temperature on the Microstructure and Properties of the Copper Synthesized by Powder Metallurgy Route

Abstract

Present work is a focus to get the optimum value of the sintering temperature of the Cu by conducting a comparative study of the microstructure and properties. The specimens of the Cu were prepared by conventional powder metallurgy route for different sintering temperatures. Surface morphology and phase formation were characterized by FESEM and XRD techniques. The micrograph of the Cu surface at a low sintering temperature of 700 °C depicts the poor surface integrity and presence of pores. It may refer to the improper diffusion of the Cu atom. The viscous and plastic flow is dominating diffusion mechanisms at low sintering temperatures. Whereas, the sintered Cu depicts the superior interface adhesion and surface integrity for 1000 °C sintering temperature. It may refer to the proper diffusion of the Cu atom. The volume and surface diffusion are the dominating sintering mechanism of the Cu at elevated temperature. It significantly improves the interface adhesion and densification. Results highlight the high value of density (8.73 g/cm3) and micro-hardness (73.50 HV) at a high sintering temperature of 1000 °C which attribute to the proper diffusion of the Cu atoms at 1000 °C.