Strain measurement at temperatures up to 800°C utilizing digital image correlation

Abstract

An experimental technique is introduced to measure full field strains using three dimensional digital image correlation at temperatures up to 800 °C. Challenges include: thermal air gradients, speckle pattern adhesion, image distortion due to viewing window deformation, camera calibration, and infrared light pollution of the camera sensor. Elements of the test setup are designed to address all of these challenges. The technique is used to measure full-field strains on Ti-6A1-4V specimens as they are loaded to failure in tension. The technique provides substantially more data than traditional elevated temperature strain measurement methods. © The Society for Experimental Mechanics, Inc. 2014.