We have investigated the resist removal by using wet ozone. Removal rate of the resist was optimum when both of the wet ozone and substrate temperature was at around 60°C. In that condition, the resist removal was better as decreasing the ozone irradiation interval time. Furthermore, in the better conditions the removal rate of resist was accomplished up to 3.4 μm/min by means of being 1.30mm of gap length between the substrate and the ozone irradiation nozzle. In spite of the implanted ion species, the resist with ions of 5×1012 atoms/cm2 could be removed. It was found that the resist removal rate by using wet ozone was corresponded to the removing with chemicals. ©2007TAPJ.
CITATION STYLE
Horibe, H., Yamamoto, M., Ichikawa, T., Kamimura, T., & Tagawa, S. (2007). Resist removal by using wet ozone. Journal of Photopolymer Science and Technology, 20(2), 315–318. https://doi.org/10.2494/photopolymer.20.315
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