Computational Study of Mixed Convection of Electronic Chips with Surface Radiation

Abstract

In this present study, the effect of heat spreader in a horizontal channel consisting of electronic chips with mixed convection and surface radiation is examined. SIMPLER algorithm with finite volume method is used to solve governing equations using ANSYS 16.2 software. Results show the increase in the performance of heat transfer with an increase in the values of governing parameters like Reynolds number and emissivity of the spreader.