Pulse Magnetron Sputtering with high power density-an attempt at a critical evaluation

Abstract

In this paper specific advantages and disadvantages of different pulse magnetron sputtering processes (unipolar, bipolar and HIPIMS) as well as current and potential fields of application will be discussed. On the examples of ZrN, Ti and TiO2 the typical effects and their influence on film properties occurring during the transition from classical medium frequency pulse magnetron sputtering to high energy pulse sputtering will be described. The discharge current density was varied between 0.2 and 3.5 A/cm2. Aspects of energy feed-in and reactive process control in the transition mode will be considered. Furthermore the influence of rising ionisation on the occurrence of crystalline phases and on mechanical, optical and photocatalytic properties of the layers will be presented. The paper concludes with a placement of the processes related to other PVD-processes that is based on further own experimental results and evaluation of dependencies as well as considering published results of other groups regarding pulse magnetron sputter processes of high power density for the deposition of hard coatings and TCO. © Published under licence by IOP Publishing Ltd.