CITATION STYLE
Kao, I., Chung, C., & Moreno Rodriguez, R. (2010). Wafer Manufacturing and Slicing Using Wiresaw. In Springer Handbook of Crystal Growth (pp. 1719–1736). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-540-74761-1_52
Mendeley helps you to discover research relevant for your work.