Hybrid antibacterial fabrics with extremely high aspect ratio Ag/AgTCNQ nanowires

Abstract

This study reports the synthesis of extremely high aspect ratios (>3000) organic semiconductor nanowires of Ag-tetracyanoquinodimethane (AgTCNQ) on the surface of a flexible Ag fabric for the first time. These one-dimensional (1D) hybrid Ag/AgTCNQ nanostructures are attained by a facile, solution-based spontaneous reaction involving immersion of Ag fabrics in an acetonitrile solution of TCNQ. Further, it is discovered that these AgTCNQ nanowires show outstanding antibacterial performance against both Gram negative and Gram positive bacteria, which outperforms that of pristine Ag. The outcomes of this study also reflect upon a fundamentally important aspect that the antimicrobial performance of Ag-based nanomaterials may not necessarily be solely due to the amount of Ag+ ions leached from these nanomaterials, but that the nanomaterial itself may also play a direct role in the antimicrobial action. Notably, the applications of metal-organic semiconducting charge transfer complexes of metal-7,7,8,8-tetracyanoquinodimethane (TCNQ) have been predominantly restricted to electronic applications, except from our recent reports on their (photo)catalytic potential and the current case on antimicrobial prospects. This report on growth of these metal-TCNQ complexes on a fabric not only widens the window of these interesting materials for new biological applications, it also opens the possibilities for developing large-area flexible electronic devices by growing a range of metal-organic semiconducting materials directly on a fabric surface. The synthesis of Ag-tetracyanoquinodimethane (TCNQ) nanowires of extremely high aspect ratios (>3000) supported on a metallic silver fabric is reported. These Ag/AgTCNQ fabrics show higher antimicrobial performance against both Gram negative and Gram positive bacteria than pristine Ag fabrics. This study extends the applicability of metal-TCNQ charge transfer complexes beyond electronics applications and opens up new avenues towards flexible electronics. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.