Comparative study of finite element analysis software packages

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Abstract

research of the work is dedicated on comparing the abilities of Finite Element Analysis of software packages Abaqus (Computer-aided engineering), Ansys (Mechanical), SOLIDWORKS and Inventor Nastran. The next software packages were selected as they are the popular products in the market today. In the Introduction the meaning of Finite Element Analysis tool is explained. Abaqus (Computer-aided engineering), Ansys (Mechanical), SOLIDWORKS, Inventor Nastran are described in the part of Literature review. From point of view their capabilities and specific features by compared to each other. Using the available data form the software packages the comparison took place. The outcome of the research illustrated that all four software packages capabilities are almost the same. However, the most diverse from the list was SOLIDWORKS. Abaqus (Computer-aided engineering), Ansys (Mechanical), Inventor Nastran has similar abilities. The difference was that Inventor Nastran is not capable of performing acoustic analysis. SOLIDWORKS differ from others in terms of it does not performs acoustic, Electric/magnetic Fluid flow and Fluid structure interaction. it also was point out that limited versions, that come free has some restriction when dealing with mesh. It was said that limitation constrains the quantity of nodes in the structure, which limits the analysis. By last the results, it was observed from the given data that SOLIDWORKS is aimed mainly on modeling a part or assembling the whole structure and doing available analysis in it. Hence SOLIDWORKS is marketed and aimed on modelling and assembly the other three software packages Abaqus (Computer-aided engineering), Ansys (Mechanical) and Inventor Nastran are analysis tools, which are utilized by the investigators and industry.

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APA

Magomedov, I. A., & Sebaeva, Z. S. (2020). Comparative study of finite element analysis software packages. In Journal of Physics: Conference Series (Vol. 1515). Institute of Physics Publishing. https://doi.org/10.1088/1742-6596/1515/3/032073

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