Silver particle carbon-matrix composites as thick films for electrical applications

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Abstract

Silver particle (3 μm) carbon-matrix composites in the form of thick films (around 100 μm thick) on alumina, as prepared from pastes comprising silver and mesophase pitch particles (14 μm), have been attained. The films on alumina were fired at 650°C in nitrogen to convert pitch to carbon. The volume electrical resistivity attained ranged from 10 -5 Ω cm to 10 4 Ω cm, depending on the silver volume fraction. The percolation threshold was 12 vol% silver. © 2007 TMS.

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Hsu, Y. C., & Chung, D. D. L. (2007). Silver particle carbon-matrix composites as thick films for electrical applications. Journal of Electronic Materials, 36(9), 1188–1192. https://doi.org/10.1007/s11664-007-0187-4

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