Simultaneous arrayed formation of single-electron transistors using electromigration in series-connected nanogaps

Abstract

A field-emission-induced electromigration method (activation) is reported for integrating single-electron transistors operating at T = 298 K. The field emission currents between the two opposite electrodes of each series-connected nanogap are tuned to accumulate Ni atoms within the gaps. For ten series-connected nanogaps, the resistance (VD/ID), obtained using the current-voltage (ID-VD) properties of these nanogaps during the activation procedure, is observed to decrease on activation. As a result, island structures are formed within the gaps, and the nanogap-based single-electron transistors can be integrated, when atom migration occurs at the tip of each nanogap electrode. After activating the ten series-connected nanogaps with a preset current, IS = 1 nA, current suppression (representative of coulomb blockade) is not observed in the fabricated devices. On the other hand, coulomb blockade, which depicts the charging and discharging of the nanoislands, can be observed at room temperature, after activation with a preset current, IS = 150 nA. Furthermore, the modulation properties of the coulomb blockade voltage by the gate voltage are also determined at room temperature. These results experimentally demonstrate the arrayed formation of ten single-electron transistors operating at room temperature, constituting a significant step toward the practical realization of single-electron-transistor-based systems.