Microelectromechanical systems and packaging

Abstract

Microelectromechanical systems (MEMS) technology enables us to create different sensing and actuating devices integrated with microelectronic, optoelectronic, radio frequency (RF), thermal, and mechanical devices for advanced microsystems. In all these systems that demand low cost and small size, MEMS packaging is usually a major consideration. The relationship between MEMS and packaging, however, is not limited to packaging of MEMS devices. MEMS devices can in fact be used to enhance packaging technologies for microelectronic, optoelectronic and RF systems. In addition, packaging technologies can be applied to fabricate MEMS devices. Therefore, packaging and MEMS technologies are essential to integrate sensors and actuators with other components on a single system platform. MEMS reliability as showstopper can be removed, and there is a great opportunity to apply MEMS and packaging technologies to develop fully integrated micro/nanosystems in the future. © 2009 Springer-Verlag US.