Influence of TLP bonding on creep deformation of a nickel-base single crystal superalloy at high temperature

Abstract

The creep substructures of TLP joint of a nickel-base single crystal superalloy at different creep stages are investigated at 982 °C/248MPa. The results show that the creep process of TLP joint consists of primary stage, steady stage and tertiary stage obviously. The creep curve shape of TLP joint is similar to that of matrix sample without bonding. The deformation substructures of different parts of TLP joint are almost same and this indicates the deformation of TLP joint is homogeneous. During creep deformation, there are more dislocations appeared in matrix sample and dislocation interactions are much pronounced than these observed in TLP joint.