Demonstration of atmospheric plasma activated direct bonding of N-polar GaN and β-Ga2O3(001) substrates

Abstract

Direct wafer bonding of β-Ga2O3 and N-polar GaN at a low temperature was achieved by acid treatment and atmospheric plasma activation. The β-Ga2O3/GaN surfaces were atomically bonded without any loss in crystalline quality at the interface. The impact of post-annealing temperature on the quality of bonding interfaces was investigated. Post-annealing at temperatures higher than 700 °C increases the area of voids at bonded interfaces probably due to the difference in the coefficient of thermal expansion. The integration of β-Ga2O3 on the GaN substrate achieved in this work is one of the promising approaches to combine the material merits of both GaN and Ga2O3 targeting the fabrication of novel GaN/β-Ga2O3 high-frequency and high-power electronics as well as optoelectronic devices.