Abstract
Basket technique, semiadditive method, and tank etching are the latest electroplating technologies discussed today. The use of the copper catalyst as the possibility to control the starting reaction in the copper bath is explained.
Cite
CITATION STYLE
APA
Fischer, H. (1985). LEITERPLATTENTECHNOLOGIE. Oberflache Zurich, 26(7), 274–276. https://doi.org/10.1007/978-3-8348-8312-4_7
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