Effective Acquisitions of Plastic, Creep, Viscoplastic Parameters of Solder Using the Relaxation Method

Abstract

This paper reports on the intensive investigation of a method to estimate the lifetime of solder joints in electronic equipment. Assessing thermal fatigue reliability requires knowledge of the me chanical properties of the inelasticity of solder joints at several temperatures. However, measuring solder properties is expensive and time consuming. A quick and simple investigating technique is needed immediately. In this article, a tensile test with a relaxation method is proposed in order to obtain several parameters such as creep constant and index, and the viscoplastic parameters defined by L. Anand et al. We compare the acquisition of solder characteristics by the conventional method and the new method, using relaxation part to reduce the numbers of experiments. © 2007, The Japan Institute of Electronics Packaging. All rights reserved.