Interface Fracture Mechanics

Abstract

 Several systems and technologies use materials in film form to achieve both their structural and functional requirements:  Microelectronic Integrated Circuits  Magnetic Information Storage Systems  Microelectromechanical Systems (MEMS)  Coatings for Thermal, Oxidation, Corrosion and Wear Resistance  Issues for study:  Origin of stresses in film-substrate systems & multi-layer systems  Types of failure mechanisms  Mechanics aspects and criteria governing these mechanisms  Characterization of relevant material constants (like toughness)