Coating technologies for copper based antimicrobial active surfaces: A perspective review

Abstract

Microbial contamination of medical devices and treatment rooms leads to several detrimental hospital and device‐associated infections. Antimicrobial copper coatings are a new approach to control healthcare‐associated infections (HAI’s). This review paper focuses on the efficient methods for depositing highly adherent copper‐based antimicrobial coatings onto a variety of metal surfaces. Antimicrobial properties of the copper coatings produced by various deposition methods including thermal spray technique, electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition (PVD), and sputtering techniques are compared. The coating produced using different processes did not produce similar properties. Also, process parameters often could be varied for any given coating process to impart a change in structure, topography, wettability, hardness, surface roughness, and adhesion strength. In turn, all of them affect antimicrobial activity. Fundamental concepts of the coating process are described in detail by highlighting the influence of process parameters to increase antimicrobial activity. The strategies for developing antimicrobial surfaces could help in understanding the mechanism of killing the microbes.