Typical processing steps with porous silicon

Abstract

Porosified silicon wafers or powders from electrochemical etching often require a series of additional processing steps, prior to use. These can include patterning, drying, comminution, manipulation of surface chemistry, sintering, impregnation, or coating, in order to achieve the desired substrates, membranes, microparticles, or nanoparticles. Typical process flows are illustrated, giving examples of where the choice and order of processing steps can be important. Examples are also given of processing topics yet to be widely explored with porous silicon, but which could become important for some of the emerging applications.