The temperature and strain rate dependence of the flow stress of tantalum was studied between 78 to 800 K at strain rates from 10-5 to 2×104 sec-1. The effect of temperature and strain rate on the lower yield stress can be explained by a model incorporating the combined operation of the Peierls mechanism and dislocation drag processes. The general behaviour of the stress-strain curve at various strain rates and temperatures is analysed in terms of a rate-temperature parameter. © 1977 Chapman and Hall Ltd.
CITATION STYLE
Hoge, K. G., & Mukherjee, A. K. (1977). The temperature and strain rate dependence of the flow stress of tantalum. Journal of Materials Science, 12(8), 1666–1672. https://doi.org/10.1007/BF00542818
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