Homogeneous 3D integration

Abstract

This chapter focuses on homogeneous 3D integration-that is, the vertical assembly of like materials or components-but also provides information about homogeneous 3D assemblies in combination with other 2D or 3D devices. One example of homogeneous integration is the stacking of memory layers to create a 3D memory device. In such a device, the component layers are usually made of the same material and are often virtually identical in design. This chapter uses 3D DRAM as a reference application. © 2011 Springer Science+Business Media, LLC.