The reduction kinetic of the combined Cu-Based oxygen carrier used for chemical looping gasification technology

Abstract

The oxygen uncoupling property of the oxygen carrier is essential for the chemical looping gasification process. In this paper, the combined Cu-based oxygen carrier were prepared by mechanical mixing method. XRD and SEM were used to characterize the oxygen carrier prepared. TG experiments were performed in a thermal analyzer to investigate the oxygen uncoupling property. The XRD pattern of the fresh oxygen carriers showed that the phases of the oxygen carriers were stable. The active phase of oxygen carrier was CuxMn3-xO4. With the increasing of heating rate, the starting and ending temperatures of the reduction reaction increased. However, the reaction time decreased and the reduction rate increased. With the increasing of oxygen concentration, the starting temperatures of the reduction reaction shifted to high level. Temperature had great effect on the reduction rate and the reduction rate increased with increasing of the reduction temperatures.