Magnesium and manganese were electrodeposited on stainless steel 430 and oxidized in air at 800°C to form a spinel coating. Electrical conductivity of MgMn 2 O 4 spinel was determined to be ~2 S/cm at 800°C. An under layer of copper aided uniform manganese deposition and uniform spinel formation. Copper in the spinel also increased conductivity (Cu 0.7 Mg 0.3 Mn 2 O 4 ~60 S/cm at 800°C). The ternary Cu-Mg-Mn system has a wide spinel stability region compared to binary systems. CuMn 2 O 4 spinel without magnesium has higher conductivity (~100 S/cm at 800°C) but this coating tended to bubble and detach from the substrate. The bubbling effect was reduced when magnesium was co-deposited.
CITATION STYLE
Joshi, S., Silva, C., & Petric, A. (2013). Magnesium Manganese Spinel Coatings for Solid Oxide Fuel Cell Interconnects. ECS Transactions, 50(27), 153–160. https://doi.org/10.1149/05027.0153ecst
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